Ruggedised Rolling Robot
speaker: Nicholas event: Hackware 2.6
survive drop test from 4m using cardboard mesh. high density foam, silicon sealant pid dammper to allow the robot to move in a straight line
speaker: Nicholas event: Hackware 2.6
survive drop test from 4m using cardboard mesh. high density foam, silicon sealant pid dammper to allow the robot to move in a straight line